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Controlled Failure Structure for Ceramic/Metal Assemblies

IP.com Disclosure Number: IPCOM000059998D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Blake, BE: AUTHOR

Abstract

When a metal pin is brazed or soldered to the surface of a ceramic body, excessive force on the pin can cause a rupture of the ceramic body or the metal to ceramic interface. Either type of failure cannot be repaired, destroying the assembly. A solution is herein described whereby a reduction in the thickness of the shank of the pin causes failure of the pin shank, permitting the assembly to be repaired by standard pin replacement methods. The figure shows a sectional view of the ceramic/pin assembly. It consists of the ceramic body 1, a metallized pad 2 fired onto the ceramic, braze alloy or solder 3, headed pin 4 with a reduced shank section 5.

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Controlled Failure Structure for Ceramic/Metal Assemblies

When a metal pin is brazed or soldered to the surface of a ceramic body, excessive force on the pin can cause a rupture of the ceramic body or the metal to ceramic interface. Either type of failure cannot be repaired, destroying the assembly. A solution is herein described whereby a reduction in the thickness of the shank of the pin causes failure of the pin shank, permitting the assembly to be repaired by standard pin replacement methods. The figure shows a sectional view of the ceramic/pin assembly. It consists of the ceramic body 1, a metallized pad 2 fired onto the ceramic, braze alloy or solder 3, headed pin 4 with a reduced shank section 5.

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