Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Process for Enhanced Polyimide Adhesion

IP.com Disclosure Number: IPCOM000060087D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chaker, M: AUTHOR [+4]

Abstract

An aqueous solution of ethylenediamine (AED) is used prior to the usual amino silane adhesion promoter treatment to improve bonding of polyimide subsequently applied to surfaces comprised of areas of cured polyimide, silicon nitride, and metal, e.g. aluminum copper.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Process for Enhanced Polyimide Adhesion

An aqueous solution of ethylenediamine (AED) is used prior to the usual amino silane adhesion promoter treatment to improve bonding of polyimide subsequently applied to surfaces comprised of areas of cured polyimide, silicon nitride, and metal, e.g. aluminum copper.

AED removes oxides (which normally inhibit amino-silane attachment) from metal surfaces and creates a thin, uniform metal hydroxide film. Aqueous amino- silane adhesion promoter interacts with the newly formed metal hydroxide surface, attaching the adhesion promoter through siloxane linkages. This is similar to the attachment of the adhesion promoter which occurs on silicon nitride surfaces. Silicon nitride surfaces are unaffected by the AED. AED reacts with cured polyimide to form a surface of an alkyl-aryldiamide rich material. Polyamic acid reacts with the alkyl-aryldiamide rich surface forming amine acid salts which thermally cure to form surface bound polyimide linkages.

Thus, the bonding of an applied polyamic acid, fully cured to become a layer of polyimide, is excellent on the metal and polyimide regions of the surface and remains excellent on the silicon nitride regions when the AED pretreatment is employed.

Disclosed anonymously.

1