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Heat Dissipation Device And Fabrication Method

IP.com Disclosure Number: IPCOM000060088D
Original Publication Date: 1986-Feb-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Gautesen, VB: AUTHOR [+3]

Abstract

Holes are formed in a polymer tape by punching and a metal tape is adhered to one side of the punched polymer tape. The cavities thus formed are filled with a thermally conductive grease, thus forming a conductive heat path from one metal tape, through the thermal grease in the cavities, to the second metal tape. Semiconductor chips, are pressed into contact with the flexible metal tape at the cavity positions to result in good heat dissipation from the chip.

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Heat Dissipation Device And Fabrication Method

Holes are formed in a polymer tape by punching and a metal tape is adhered to one side of the punched polymer tape. The cavities thus formed are filled with a thermally conductive grease, thus forming a conductive heat path from one metal tape, through the thermal grease in the cavities, to the second metal tape. Semiconductor chips, are pressed into contact with the flexible metal tape at the cavity positions to result in good heat dissipation from the chip.

As shown in the figure, polymer tape 2, e.g. .010 to .016 inch thick polyimide, has holes 3 punched therein. The punched polymer 2 is adhered to an adhesive backed .005 inch thick metal tape 4 which is commercially available to close the holes 3. The holes 3 are now filled with a thermally conductive grease 6. A second adhesive backed metal tape 8 is adhered to the polymer 2 to seal in the grease 6 in the cavities 3.

This thermally conductive unit is cut and mounted such that light pressure contact to the backside of semiconductor chips is obtained. A thin layer of thermally conductive grease can be applied to the chips. The metal tape is sufficiently thin that it can be deflected slightly by the pressure applied, thus promoting comformity of the chip and the metal tape. Thus, mounting tolerances are not severe, even for multiple chips, yet good thermal dissipation from the chips is obtained.

Disclosed anonymously.

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