Browse Prior Art Database

Xylylene Diamine As an Adhesion Promoter for Polyimide to Polyimide Laminates

IP.com Disclosure Number: IPCOM000060128D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Linde, HG: AUTHOR

Abstract

This article introduces a diamine adhesion promoter with an aromatic nucleus that doubles the adhesion strength, increases thermal stability, and eliminates allergic sensitization problems when used on polyimide/polyimide laminate structures. Polyimide/polyimide adhesion failures have been linked to the root cause of semiconductor corrosion problems. To eliminate delamination, a chemical bond between the two layers of polyimide using m-xylylene diamine as an adhesion promoter has shown the crosslink to be thermally stable and safe to use. Aliphatic diamines react with cured and uncured polyimides (polyamic acid). The reaction covalently attaches a free aliphatic amine to the imide surface through an amide linkage, as shown in Fig. 1.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 90% of the total text.

Page 1 of 2

Xylylene Diamine As an Adhesion Promoter for Polyimide to Polyimide Laminates

This article introduces a diamine adhesion promoter with an aromatic nucleus that doubles the adhesion strength, increases thermal stability, and eliminates allergic sensitization problems when used on polyimide/polyimide laminate structures. Polyimide/polyimide adhesion failures have been linked to the root cause of semiconductor corrosion problems. To eliminate delamination, a chemical bond between the two layers of polyimide using m-xylylene diamine as an adhesion promoter has shown the crosslink to be thermally stable and safe to use. Aliphatic diamines react with cured and uncured polyimides (polyamic acid). The reaction covalently attaches a free aliphatic amine to the imide surface through an amide linkage, as shown in Fig. 1. The surface conditioning provides a basic amine interface which is favorable for polyamic acid lamination. Thus, ethylene diamine functions as an adhesion promoter for polyimide-to-polyimide laminates. Unfortunately, ethylene diamine is a potent allergic sensitizer and can not be used in line processing. m-Xylylene diamine is an alkyl diamine with an aromatic nucleus (Fig. 2). It contains two alkyl amine functional groups which have the strong basic character necessary for sufficient polyimide-to-polyimide bonding. This functionally permits an alkylamine reaction but offers the advantage of higher thermal stability and no allergic side effects. The treatmen...