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Polyimide Primer Coatings for Void-Free Polyimide Passivation Films

IP.com Disclosure Number: IPCOM000060133D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Chaker, M: AUTHOR [+6]

Abstract

Surface modification of semiconductor devices, for the primary purpose of reducing or eliminating second level metal opens due to voids at the polyimide insulator layer silicon nitride interface of a dual dielectric passivated surface, is described in this article. As device geometries become smaller and topographically more severe, structures having deep trenches or window features become more difficult to passivate. Unfilled areas (voids) caused by the failure of the polyimide to fill or wet into the trench and window features of the structure will impact yield and reliability if lithographic images in the polyimide and second metal intercept one of these void areas.

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Polyimide Primer Coatings for Void-Free Polyimide Passivation Films

Surface modification of semiconductor devices, for the primary purpose of reducing or eliminating second level metal opens due to voids at the polyimide insulator layer silicon nitride interface of a dual dielectric passivated surface, is described in this article. As device geometries become smaller and topographically more severe, structures having deep trenches or window features become more difficult to passivate. Unfilled areas (voids) caused by the failure of the polyimide to fill or wet into the trench and window features of the structure will impact yield and reliability if lithographic images in the polyimide and second metal intercept one of these void areas. Also, voids adjacent to a second level metal line may act as a site for capillary condensation and degrade the ability of the device to withstand stress environments. Polyimide primer coats reduce or eliminate the formation of voids at the interface of the polyimide insulator layer and silicon nitride by modifying the nitride surface on to which the bulk polyimide is to be coated. The primer coats are characterized by low solids, low viscosity and low surface tension attributes. N-methyl pyrrolidone, xylene, toluene, polycarbonate resins and diglyme, in the appropriate quantities, are the solvents used to dilute the polyimide which will be used as a primer. Primer coats are tailored to reflect the semiconductor performance requirem...