Browse Prior Art Database

Power Distribution Cap

IP.com Disclosure Number: IPCOM000060159D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Blum, A: AUTHOR [+2]

Abstract

For the low-ohmic power supply and the mechanical sealing of VLSI packages, a twin cap is proposed which eliminates power supply pins. Modern IC chips are arranged in separate small housings or are flip-chip soldered to substrates of ceramic, plastic, silicon, etc. In such cases, the supply voltages are either fed to solder tags through so-called wirebonds or are applied to solder pins of the substrates through wiring planes. The substrates are covered by metal caps which are merely used as hermetic seals and for inscription. The figure shows an improved embodiment in the form of a twin cap mounted on, say, a multilayer ceramic (MLC) module substrate (not shown). The twin cap comprises an outer GND cap and an insulated inner +V cap connected thereto.

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Power Distribution Cap

For the low-ohmic power supply and the mechanical sealing of VLSI packages, a twin cap is proposed which eliminates power supply pins. Modern IC chips are arranged in separate small housings or are flip-chip soldered to substrates of ceramic, plastic, silicon, etc. In such cases, the supply voltages are either fed to solder tags through so-called wirebonds or are applied to solder pins of the substrates through wiring planes. The substrates are covered by metal caps which are merely used as hermetic seals and for inscription. The figure shows an improved embodiment in the form of a twin cap mounted on, say, a multilayer ceramic (MLC) module substrate (not shown). The twin cap comprises an outer GND cap and an insulated inner +V cap connected thereto. The figure is a partially sectional representation of the GND cap to afford a view of the inner +V cap. The outer GND cap is completely closed along its edge 1. Edge 1 will be soldered to a suitably shaped conductor ring 2 on the substrate. Preferably in the center, the GND cap has an opening for the solder joint area (+V) of the external power cable; the solder joint area for the external GND connection is also indicated. In the region of the GND cap opening, insulation 3 is shown between the GND and the +V cap. On the substrate surface, finger-shaped conductor lands (not shown in detail) extend from conductor ring 2 to the inner substrate surface below the twin cap. For that purpose, the edge...