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Substrate Thin Film Separator

IP.com Disclosure Number: IPCOM000060290D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Busacco, RA: AUTHOR [+3]

Abstract

The deliberate, controlled breaking of substrates for the purpose of initiating the peel-back of thin films for peel tests that verify the adhesion of thin films, e.g., photoresist, dielectric or metallized surfaces, is accomplished in a device that works in the following manner. A substrate 1 (Fig. 1) is located film side up on a recessed work surface 2 on a thin rubber cushion 3. A vee groove 4 is located on the device base 5 under substrate 1. A round rod 6 is placed on the top of substrate 1 along the axis of the desired break. A spring-loaded punch 7 is located directly over substrate 1 on center and perpendicular to the round rod 6. The punch handle 8 is retracted to place spring 9 in compression. When the punch handle 8 is released, the compressed spring 9 acts to force punch 7 downward to strike round rod 6.

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Substrate Thin Film Separator

The deliberate, controlled breaking of substrates for the purpose of initiating the peel-back of thin films for peel tests that verify the adhesion of thin films, e.g., photoresist, dielectric or metallized surfaces, is accomplished in a device that works in the following manner. A substrate 1 (Fig. 1) is located film side up on a recessed work surface 2 on a thin rubber cushion 3. A vee groove 4 is located on the device base 5 under substrate 1. A round rod 6 is placed on the top of substrate 1 along the axis of the desired break. A spring-loaded punch 7 is located directly over substrate 1 on center and perpendicular to the round rod 6. The punch handle 8 is retracted to place spring 9 in compression. When the punch handle 8 is released, the compressed spring 9 acts to force punch 7 downward to strike round rod 6. The round rod 6 impacts on substrate 1 to cause a break along the axis. The break will coincide with a scribed line (not shown) on the bottom surface of substrate 1 or along a row of holes 10 (Fig. 2) on substrate 1. After substrate 1 is broken, it is removed from work surface 2 and placed in peeling slot 11 (Fig. 1) of device base 5 with the substrate edge 12, that is parallel to the break axis, placed in peel slot 11. The other part of the broken substrate is pulled away from the secured part of the substrate and the film is peeled. The resulting substrate is seen in Fig. 2.

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