Browse Prior Art Database

Transfer Tool

IP.com Disclosure Number: IPCOM000060578D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Pelella, LF: AUTHOR

Abstract

In the processing of semiconductor wafers it is necessary to move them from one station to another for various reasons. The disclosed tool makes it possible to transfer a wafer without disturbing a surface thereof which may be in an uncured or wet condition. Tools conventionally available for transferring wafers are tweezers or vacuum pencils. They have a shortcoming in that where a surface may be wet, it is prone to being smeared by the tools when moved prior to curing. The present device can catch the uncured wafer by its edges so that the surface is untouched. The tool consists of a large cup, approximately twice the diameter of the wafer and half a diameter high. A rubber or plastic membrane is stretched across the cup and drawn down in the center with a nut, bolt, and washer to form a cusp.

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Transfer Tool

In the processing of semiconductor wafers it is necessary to move them from one station to another for various reasons. The disclosed tool makes it possible to transfer a wafer without disturbing a surface thereof which may be in an uncured or wet condition. Tools conventionally available for transferring wafers are tweezers or vacuum pencils. They have a shortcoming in that where a surface may be wet, it is prone to being smeared by the tools when moved prior to curing. The present device can catch the uncured wafer by its edges so that the surface is untouched. The tool consists of a large cup, approximately twice the diameter of the wafer and half a diameter high. A rubber or plastic membrane is stretched across the cup and drawn down in the center with a nut, bolt, and washer to form a cusp. The membrane has three 1 1/2" holes cut into it in a circular equidistant pattern, such that the center of the holes is located at or near the periphery of the wafer. The tool is equipped with a handle for ease of moving. A photograph of the tool is shown in the figure. In operation, the wafer being processed is released above the tool so that it drops onto the membrane. Only its edges touch the membrane. The tool holding the wafer is then moved to the next station, presumably for curing. At this time the operator may reach into the three holes in the membrane with finger cots to lift the wafer off the tool and place it in the curing station. During the tran...