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Soldering Protruding Pins or Connectors on Flexible Circuits

IP.com Disclosure Number: IPCOM000060579D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Fry, BM: AUTHOR [+2]

Abstract

Conventional methods of solder paste application do not allow protrusions above the printed circuit plane. Some arrangements require the assembly of pinned headers to a polyimide flexible printed circuit. Applying paste to this flex circuit and then placing it over the pins is not feasible because most of the soft paste is distorted or damaged in the process. Also, this flex circuit buckles when placed in the vapor phase reflow process. A pin block assembly using surface mount techniques is fabricated by two different methods. This assembly consists of two (2x10 pin headers) with a plastic interposer and a flexible polyimide printed circuit on top. This unit is joined by soldering the pins extending up through the interposer and circuit. Two methods of assembly are described.

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Soldering Protruding Pins or Connectors on Flexible Circuits

Conventional methods of solder paste application do not allow protrusions above the printed circuit plane. Some arrangements require the assembly of pinned headers to a polyimide flexible printed circuit. Applying paste to this flex circuit and then placing it over the pins is not feasible because most of the soft paste is distorted or damaged in the process. Also, this flex circuit buckles when placed in the vapor phase reflow process. A pin block assembly using surface mount techniques is fabricated by two different methods. This assembly consists of two (2x10 pin headers) with a plastic interposer and a flexible polyimide printed circuit on top. This unit is joined by soldering the pins extending up through the interposer and circuit. Two methods of assembly are described. The first is the standard method of screening solder paste on the flexible circuit and, then assembling the components in a specially designed fixture and vapor phase reflow. The second method eliminates the screening process and, by a uniquely designed cavity-type fixture, applies a predetermined amount of solder paste to each pin. This fixture also serves to hold the components in place during the reflow process. These methods capitalize on a uniquely designed fixture. This fixture provides a housing for the component assembly, which also has the capability to eliminate the costly solder screening process. Utilization of this spe...