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Dip Tinner Solder Well

IP.com Disclosure Number: IPCOM000060596D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-08
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Backes, JL: AUTHOR [+2]

Abstract

The solder dipping of various fluxed parts into a solder well leaves a residual dross that can interfere with subsequent soldering. The utilization of an impeller to create a solder flow to direct the dross away from the soldering area provides for clean soldering. The device works in the following manner.

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Dip Tinner Solder Well

The solder dipping of various fluxed parts into a solder well leaves a residual dross that can interfere with subsequent soldering. The utilization of an impeller to create a solder flow to direct the dross away from the soldering area provides for clean soldering. The device works in the following manner.

A solder well 1 is outfitted with an impeller 2 which when driven by a shaft (not shown) creates a solder flow downward through the impeller 2 and along the long direction of solder pot 1, as seen by the arrows, up through the application holes 3 where component to be soldered 4 is placed. The scrubbing-action of impeller-driven solder emitting from application holes 3 provides improved soldering. Solder pot 1 has a dam 5 on the ends to restrain the dross from flowing over the solder well 1 into impeller 2 and recirculating.

The impeller 2 is driven at approximately 10-15 rpm to prevent the dross from either moving away from the side of the solder well or having the impeller itself create excessive dross.

Disclosed anonymously.

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