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Browse Prior Art Database

Deposition of Sandwich Metallurgy

IP.com Disclosure Number: IPCOM000060616D
Original Publication Date: 1986-Mar-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Baum, TH: AUTHOR [+4]

Abstract

Open defects in packaging can be repaired by depositing the repair lines as a sandwich of chromium/copper/chromium. This can be accomplished in two different ways, corresponding to the two different deposition mechanisms.

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Deposition of Sandwich Metallurgy

Open defects in packaging can be repaired by depositing the repair lines as a sandwich of chromium/copper/chromium. This can be accomplished in two different ways, corresponding to the two different deposition mechanisms.

The simpler method involves photothermal deposition of chromium with visible light. When the precursor compound decomposes at a lower temperature than does the copper precur milder heating of the substrate produces deposited metal and leaves no substrate damage. The alternative method begins with photochemical deposition of chromium by scanning a focused uv laser across the open to dissociate a volatile chromium complex and deposit a chromium line in the repair region. The initial chromium deposition is followed in either case by photothermal deposition of copper in the usual manner. Finally, the chromium deposition process is repeated to generate the protective chromium overlayer.

This process will improve adhesion, oxidation resistance, and solder resistance of the copper repair lines. It also eliminates damage to the polyimide substrate, since copper deposition will occur on chromium rather than on the bare polymer.

Disclosed anonymously.

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