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In-line Corrosion Stress Test Monitor Post Second Level Metal for Multi-level Semiconductor Devices

IP.com Disclosure Number: IPCOM000060665D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Fresia, JF: AUTHOR [+2]

Abstract

This article describes a stress test that will detect corrosion early in a multi-level semiconductor process enabling an early evaluation of a new process or technology development and thereby enhance process development cycle times.

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In-line Corrosion Stress Test Monitor Post Second Level Metal for Multi- level Semiconductor Devices

This article describes a stress test that will detect corrosion early in a multi- level semiconductor process enabling an early evaluation of a new process or technology development and thereby enhance process development cycle times.

By removing a wafer from the process line immediately after second level metal deposition and dicing it in preparation for an accelerated corrosion stress test, rather than using the standard method of waiting until the wafer is completely processed and packaged in a module before testing, will result in significant savings in process development time.

Fig. 1 shows a schematic of the flow from a process line to corrosion test evaluation. Fig. 2 shows the technique used to prepare the sample test sites for a corrosion test. After second level metal deposition 10, a wafer is removed from the line and diced. The chips from a diced wafer are bonded onto a ceramic substrate 12 with silver polyimide 13. Gold wire 14 is then ultrasonically bonded to pads 15 on the substrate 12 and to the second level metal 10 on the chips to form a test structure.

The wire bonded test structures are stress tested in an enviroment chamber at 85 degrees C at 80% relative humidity and 15 volts DC. The effect of this stress on the test structures is monitored in-situ every 24 hours for 4 days.

The new features of this stress test are these: 1)Corrosion stress t...