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Extendable Pre-molded Plastic Package for Integrated Circuits

IP.com Disclosure Number: IPCOM000060675D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Phelps, DW: AUTHOR [+3]

Abstract

A technique is described to encapsulate an integrated circuit (IC) chip into a pre-molded lead frame sub-assembly with an option of mating one sub-assembly to another in such a manner as to provide a double density package. Chips may be mixed or matched and sealed into one integrated package with contact leads on all four sides.

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Extendable Pre-molded Plastic Package for Integrated Circuits

A technique is described to encapsulate an integrated circuit (IC) chip into a pre-molded lead frame sub-assembly with an option of mating one sub-assembly to another in such a manner as to provide a double density package. Chips may be mixed or matched and sealed into one integrated package with contact leads on all four sides.

The Figure shows a standardized lead frame 10 pre-molded into a plastic outer frame 11 around a chip site 12. The IC device is mounted on a die pad (not shown) which is an integral part of the lead frame pre-molded into the plastic outer frame 11. The IC device 13 is wire bonded to the inner lead frame fingers 14 and a pre-molded cap 11a is attached to the frame 11. A dielectric gel may be dispensed into the cavity 15 providing an Alpha barrier/contamination shield.

When the optional molded frame features matching hemimorphic contoured faces 16, two matching sub-assemblies 17 & 18 may be mated and bonded together to form a single double density package. This is done by inverting and rotating one sub-assembly and placing it on top of the other sub-assembly 18. This extension allows the mixing of memory and logic chips integrated a single sealed assembly with contact leads 19 exiting on all four sides and in the same plane.

Disclosed anonymously.

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