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Non-convection Heat Sink for Use in a Vacuum

IP.com Disclosure Number: IPCOM000060677D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Evans, RJ: AUTHOR

Abstract

A technique is described for removing heat generated by a semiconductor chip/wafer when operating in the vacuum chamber scanning electron microscope (SEM).

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This is the abbreviated version, containing approximately 60% of the total text.

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Non-convection Heat Sink for Use in a Vacuum

A technique is described for removing heat generated by a semiconductor chip/wafer when operating in the vacuum chamber scanning electron microscope (SEM).

The heat generated by a chip/wafer operating in the vacuum chamber of a SEM cannot be dissipated by convection and the amount of radiation which takes place is insufficient to keep a chip/wafer temperature within design limits, causing failure.

Chips/wafers under investigation in a SEM are normally mounted on a mechanical stage with six or seven degrees of freedom and the linear motion accuracy is in the order of one micron. Apparatus designed to conduct heat to the outside surface of a vacuum chamber encounter problems with the flexibility requirements and this approach becomes impractical.

The figure shows an apparatus for storing heat inside a vacuum chamber in the form of latent heat and the heat is released from the device by being left outside the vacuum chamber for an appropriate amount of time. The device consists of a disk shaped container 10 made up of a bottom half 11 and a top half 12. The bottom half 11 has a cavity 13 machined into a non- magnetic material which contains eutectic salt which is not shown. The top and bottom sealing surfaces 14 are machined to seal the cavity 13 because there is a pressure differential of approximately one atmosphere when the container 10 is used in the SEM vacuum chamber. The mechanical sealing surfaces 14 have a machin...