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Product Yield Advancement Test Site Structure With Anti-slip Resist Design

IP.com Disclosure Number: IPCOM000060678D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bonges, HA III: AUTHOR

Abstract

This article features a technique used to fabricate metal structures on smooth surface wafers which will minimize or elimina tendency for resist to float and slide between long narrow metal lines.

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Product Yield Advancement Test Site Structure With Anti-slip Resist Design

This article features a technique used to fabricate metal structures on smooth surface wafers which will minimize or elimina tendency for resist to float and slide between long narrow metal lines.

When the photoresist structure is used to define families of metal lines of varying widths and pitches to collect defect size and density distribution data, the photoresist has a tendency to float and slip; thus shorts can be inadvertently created with erroneous data resulting.

To correct this condition, an anchor site 10 shown in the Figure was designed in the resist line 11. Such anchor sites should be about every 50 _m along the line 11. To accommodate this anchor 10 in line 11 while maintaining the desired pitch between the lines conformal jogs 12 and 13 must be created in the adjacent resist lines 14 and 15. This anchor 10 and the conformal jogs 12 and 13 prevent the photoresist from slipping and errors due to displaced resist are minimized or eliminated.

Metal lines 18 & 19, interposed between resist lines 11 & 14 and 11 & 15 respectively conform to the resist patterns and can be used as test probes to monitor for shorts or opens in the metal test maze. Additional metal test lines 16 and 17 can be used to test for both opens and shorts.

Disclosed anonymously.

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