Browse Prior Art Database

Dimpled Module Cap for Thermal Enhancement

IP.com Disclosure Number: IPCOM000060684D
Original Publication Date: 1986-Apr-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+3]

Abstract

Thermal caps for modules are constructed such that pedestals are provided for the purpose of removing heat from chips. The pedestal is necessary because the remainder of the caps interior surface must provide clearance to prevent shorting to adjacent pin heads. Thermal grease is provided as an interface to remove heat from the chip to the pedestal but the grease is often partially displaced due to the movement of the cap during thermal cycling. This results in voids between the chip and the pedestal resulting in hot spots. This grease displacement is eliminated in a cap design that has an interior surface dimpled in such a manner as to create clearance for pin heads and to accommodate the thermal grease thereby eliminating the need for a pedestal.

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Dimpled Module Cap for Thermal Enhancement

Thermal caps for modules are constructed such that pedestals are provided for the purpose of removing heat from chips. The pedestal is necessary because the remainder of the caps interior surface must provide clearance to prevent shorting to adjacent pin heads. Thermal grease is provided as an interface to remove heat from the chip to the pedestal but the grease is often partially displaced due to the movement of the cap during thermal cycling. This results in voids between the chip and the pedestal resulting in hot spots. This grease displacement is eliminated in a cap design that has an interior surface dimpled in such a manner as to create clearance for pin heads and to accommodate the thermal grease thereby eliminating the need for a pedestal.

Fig. 1 shows the prior art with cap 1, pedestal 2, pin head 3, thermal grease 4 and chip 5.

In the new design the cap 1 (Fig. 2) is configured with dimples 2 that provide clearance with corresponding pin heads 3. Thermal grease 4 is provided to remove heat from chip 5 to cap 1.

Disclosed anonymously.

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