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Plastic Ringed High Density "J" Leaded Chip Carrier

IP.com Disclosure Number: IPCOM000060779D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Mullady, RK: AUTHOR

Abstract

This design has two parts: a ceramic leaded chip carrier and a plastic "forming ring" which receives it. The carrier 10 is shown in Figs. 1 and 2, while the forming ring 12 is shown in Figs. 3, 4 and 5. This forming ring will act as the inner die member during lead forming, in known fashion. Two lead attach configurations 14, 16 are utilized for this design, as shown in Fig. 2. The inner row 14 of leads are side brazed to the ceramic carrier 10 while the outer row 16 of leads are centered between the inner row and are top brazed to 10. The staggering of the leads 14, 16 allows for tighter ground rules on the ceramic and more relaxed ground rules on the printed circuit card 18 (Fig. 4) where they are required.

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Plastic Ringed High Density "J" Leaded Chip Carrier

This design has two parts: a ceramic leaded chip carrier and a plastic "forming ring" which receives it. The carrier 10 is shown in Figs. 1 and 2, while the forming ring 12 is shown in Figs. 3, 4 and 5. This forming ring will act as the inner die member during lead forming, in known fashion. Two lead attach configurations 14, 16 are utilized for this design, as shown in Fig. 2. The inner row 14 of leads are side brazed to the ceramic carrier 10 while the outer row 16 of leads are centered between the inner row and are top brazed to 10. The staggering of the leads 14, 16 allows for tighter ground rules on the ceramic and more relaxed ground rules on the printed circuit card 18 (Fig. 4) where they are required. ASSEMBLY DETAILS During the high temperature processing, the leads will be connected together with a tie bar 20, as shown in Fig. 1. The structure of Fig. 3 acts as a forming ring 12 for the leads 14, 16 and will snap onto the ceramic body 10, as shown in Fig. 5. No fixturing is required to hold the two pieces together during lead forming. Alignment of the leads is maintained by slots 17. The leads will then be cut to length and formed around the forming ring. This design has the following features: 1. The use of both side brazed and top brazed leads 14, 16 on the same substrate 10. 2. The use of a separate plastic forming ring 12 to aid in forming the leads of a ceramic leaded chip carrier. This yields the...