Browse Prior Art Database

Heavy Gold Rack (Wire Mesh Type)

IP.com Disclosure Number: IPCOM000060786D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Poweleit, HR: AUTHOR

Abstract

One of the process steps in manufacturing multilayer ceramic substrates is the heavy Au plating process step. Conventionally, in such process a heavy Au rack is used to have conductive paste screened onto the I/O pads of the substrate. However, by using a flexible wire mesh assembly in the rack, the same process may simply be achieved. With the new method, no screening of the conductive paste is required. Also, no removal of the paste including cleaning of the substrate is required. Tooling cost for the screener and screening mask, cleaning tank and chemicals is also eliminated. As shown in the figure, cover 1 presses on substrate 2 after the substrate is loaded into rack 3. By pressing on the substrate, the I/O pads make contact with the wire mesh assembly 4 which is connected to rod 5. The rod is electrically charged.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Heavy Gold Rack (Wire Mesh Type)

One of the process steps in manufacturing multilayer ceramic substrates is the heavy Au plating process step. Conventionally, in such process a heavy Au rack is used to have conductive paste screened onto the I/O pads of the substrate. However, by using a flexible wire mesh assembly in the rack, the same process may simply be achieved. With the new method, no screening of the conductive paste is required. Also, no removal of the paste including cleaning of the substrate is required. Tooling cost for the screener and screening mask, cleaning tank and chemicals is also eliminated. As shown in the figure, cover 1 presses on substrate 2 after the substrate is loaded into rack 3. By pressing on the substrate, the I/O pads make contact with the wire mesh assembly 4 which is connected to rod 5. The rod is electrically charged. Gasket 6 functions to prevent leaks. The top surface of the substrate is shown at 7 with the pads to be plated.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]