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High Density Electrode Systems for a Print Head

IP.com Disclosure Number: IPCOM000060806D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Mahmoud, IS: AUTHOR [+4]

Abstract

The figure shows an arrangement to provide a low cast tungsten print head. With tungsten as a material and using the sputter process to deposit and form an electrode network, overlaying the cable conductors, continuity and high resolution can be achieved. The cable can then be molded into a print head design. Sputtering can also be used for an interface between the tungsten and cable if density of the cable becomes a problem.

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High Density Electrode Systems for a Print Head

The figure shows an arrangement to provide a low cast tungsten print head. With tungsten as a material and using the sputter process to deposit and form an electrode network, overlaying the cable conductors, continuity and high resolution can be achieved. The cable can then be molded into a print head design. Sputtering can also be used for an interface between the tungsten and cable if density of the cable becomes a problem.

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