Browse Prior Art Database

Leaded Surface Mount Tinning Tool

IP.com Disclosure Number: IPCOM000060807D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Alsante, CD: AUTHOR [+2]

Abstract

A titanium solder barrier permits the hand tinning (hot solder dipping) of leaded surface mount components (flatpacks) up to the body of the component without damaging the component by direct contact with molten solder. As seen in the exploded view in Fig. 1, the solder barrier consists of four parts. The top piece is a surface plate 1 having an insert 2 containing four tapered slots that vary in width to accommodate the different body widths of flatpacks (not shown) to be soldered. A cross-sectional view of the insert 2 of surface plate 1 is provided in Fig. 2showing tapered slots 7 with the four gradations of width varying from narrowest on the left to the widest on the right. The bottom piece 3, has an interior lip 4 that fits over the solder pot (not shown).

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Leaded Surface Mount Tinning Tool

A titanium solder barrier permits the hand tinning (hot solder dipping) of leaded surface mount components (flatpacks) up to the body of the component without damaging the component by direct contact with molten solder. As seen in the exploded view in Fig. 1, the solder barrier consists of four parts. The top piece is a surface plate 1 having an insert 2 containing four tapered slots that vary in width to accommodate the different body widths of flatpacks (not shown) to be soldered. A cross-sectional view of the insert 2 of surface plate 1 is provided in Fig. 2showing tapered slots 7 with the four gradations of width varying from narrowest on the left to the widest on the right. The bottom piece 3, has an interior lip 4 that fits over the solder pot (not shown). A middle piece 5 provides clearance between surface plate 1 and the solder pot. After the insert 2 is secured to top piece 1 the three remaining pieces 1, 3 and 5 are assembled and secured by adjustable screws 6. The slots 7 are positioned over a solder wave (not shown). The height of the top plate 1 is adjusted by screws 6to permit the solder wave to come into contact with the component leads (not shown) and wick up the leads to be stopped by the insert 2 of top plate 1, thereby protecting the component (not shown).

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