Browse Prior Art Database

Heat Sink Alignment Pin

IP.com Disclosure Number: IPCOM000060830D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Kulback, SE: AUTHOR [+2]

Abstract

Technologies involved in high density packaging of circuits on chips have critical operating thermal parameters, particularly in large scale computers, which are ultimately limited by constraints of heat dissipation from the chips via thermal conduction. This article describes a heat transfer loading device which eliminates undesirable spring-load tilt characteristics to enhance thermal conduction of heat from such chips. Conventionally, heat is dissipated by a spring-loaded piston which contacts the back of a chip to provide the main thermal path to a water cooled housing. The contribution of the tilt between the chip and piston to thermal resistance is significant.

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Heat Sink Alignment Pin

Technologies involved in high density packaging of circuits on chips have critical operating thermal parameters, particularly in large scale computers, which are ultimately limited by constraints of heat dissipation from the chips via thermal conduction. This article describes a heat transfer loading device which eliminates undesirable spring-load tilt characteristics to enhance thermal conduction of heat from such chips. Conventionally, heat is dissipated by a spring-loaded piston which contacts the back of a chip to provide the main thermal path to a water cooled housing. The contribution of the tilt between the chip and piston to thermal resistance is significant. Such tilts result from the incline of the piston in its cavity due to pressure to its associated spring, as well as from the tilting of the chip when it is soldered to the substrate. To reduce the gap between the piston and chip, and hence the thermal resistance, the end of the piston 8 is ground into a spherical crown shape 10, and the pressure of the spring is concentrated centrally of that crown, at a point less than the radius thereof, forcing the piston to roll from the edges towards the center of the chip, thereby resulting in an effectively smaller gap between the chip and piston. The net effect of the crown is to reduce the effective gap between the chip and piston at relatively large tilts. Further, by making the piston contact the chip more centrally, the temperature...