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Module De-Encapsulation Tool

IP.com Disclosure Number: IPCOM000060847D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Cain, JF: AUTHOR [+3]

Abstract

Failure analysis of plastic encapsulated dual-in-plane (P-DIP) modules requires the removal of the encapsulant to expose the module circuitry. A mechanical method of separating the module at a plastic/substrate interface, without disturbing the circuit components, is accomplished as follows. To prepare the module for de-encapsulation the module leads from the DIP package must be cut and the lead stubs must be ground flush with the module edge. The module 1 (Fig. 1) is then placed in a de-encapsulation tool 2 and secured by an adjustable module backer block 3 (Fig. 2). The block 3 is moved with an adjustment screw 4 to engage module 1. With the module in the correct location a cleaving blade 5 is placed in a blade slot 6 of tool 2. The blade 5 is in alignment with the interface of module plastic/substrate interface 7.

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Module De-Encapsulation Tool

Failure analysis of plastic encapsulated dual-in-plane (P-DIP) modules requires the removal of the encapsulant to expose the module circuitry. A mechanical method of separating the module at a plastic/substrate interface, without disturbing the circuit components, is accomplished as follows. To prepare the module for de-encapsulation the module leads from the DIP package must be cut and the lead stubs must be ground flush with the module edge. The module 1 (Fig. 1) is then placed in a de-encapsulation tool 2 and secured by an adjustable module backer block 3 (Fig. 2). The block 3 is moved with an adjustment screw 4 to engage module 1. With the module in the correct location a cleaving blade 5 is placed in a blade slot 6 of tool 2. The blade 5 is in alignment with the interface of module plastic/substrate interface 7. The blade 5 is activated on aZ axis by a selected driver (not shown) until the blade 5 stops, before making contact with base plate 8. The driver actuates at a speed of 1000 mm/min. Remove the blade 5 from tool 2, and the module is removed and ready for failure analysis.

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