Browse Prior Art Database

Ground Plane Thermal Conduction Brackets

IP.com Disclosure Number: IPCOM000060877D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Cameron, W: AUTHOR [+4]

Abstract

This article describes an arrangement which uses the ground plane of multilayer printed circuit (PC) cards as athermal conduction path where heat can be conducted away from the electrical components. In computer design, component density and power requirements have increased and package size has decreased making it necessary to design sophisticated cooling schemes. The arrangement disclosed herein provides a thermal conduction path for multilayer cards via mechanical interfaces to the covers of the machine. Figs. 1 and 2 show an embodiment in perspective of the present arrangement. Ground-plane and thermal conduction brackets make use of the PC board and the covers to remove heat from a high module density, multilayered board. The internal ground plane is used as a heat path to one or more brackets.

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Ground Plane Thermal Conduction Brackets

This article describes an arrangement which uses the ground plane of multilayer printed circuit (PC) cards as athermal conduction path where heat can be conducted away from the electrical components. In computer design, component density and power requirements have increased and package size has decreased making it necessary to design sophisticated cooling schemes. The arrangement disclosed herein provides a thermal conduction path for multilayer cards via mechanical interfaces to the covers of the machine. Figs. 1 and 2 show an embodiment in perspective of the present arrangement. Ground-plane and thermal conduction brackets make use of the PC board and the covers to remove heat from a high module density, multilayered board. The internal ground plane is used as a heat path to one or more brackets. The brackets conduct heat away from the card to the box (also referred to as the front or rear personal computer cover) which is now used as a heatsink. The brackets also act as heatsinks. The ground plane is exposed at the ends of the card. This exposure is similar to the output land pattern shown in Figs. 1 and 2. The output land pattern consists of a number of small lands or pads, while the ground plane is one large internal land encompassing the whole card. The brackets are made of a high thermal conductivity material, such as copper. They are brazed or soldered to the exposed ground plane on the PC card. When the PC card i...