Browse Prior Art Database

Package for Optoelectronic Devices

IP.com Disclosure Number: IPCOM000060984D
Original Publication Date: 1986-Jun-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Bachtold, W: AUTHOR [+5]

Abstract

Proposed is a package for optical fibers and optoelectric devices that provides for precise and mechanically stable interfaces between fibers and devices mounted on a substrate. The fibers are guided and fixed in place utilizing a cap of photosensitive glass, i.e., a material permitting precise etching of holes using lithographic processes. The figure schematically shows a package in which chips A and B carrying devices such as optical transmitters and receivers or electric circuitry are mounted on a conventional ceramic substrate using solder ball or wire bonding. Depending on the devices, the chips may be bonded face down or face up, using proper bonding techniques, and the fiber connections may be either to the side of the devices (chip A), e.g., for edge-emitting lasers, or to the top (chip B) as, e.g.

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Package for Optoelectronic Devices

Proposed is a package for optical fibers and optoelectric devices that provides for precise and mechanically stable interfaces between fibers and devices mounted on a substrate. The fibers are guided and fixed in place utilizing a cap of photosensitive glass, i.e., a material permitting precise etching of holes using lithographic processes. The figure schematically shows a package in which chips A and B carrying devices such as optical transmitters and receivers or electric circuitry are mounted on a conventional ceramic substrate using solder ball or wire bonding. Depending on the devices, the chips may be bonded face down or face up, using proper bonding techniques, and the fiber connections may be either to the side of the devices (chip A), e.g., for edge-emitting lasers, or to the top (chip B) as, e.g., for surface-emitting diodes or photosensors. The chips are covered by a protective cap that also serves as a guide for the fibers connecting to the chips. The cap consists of a material that allows wet-etching of precise guiding holes for the fibers. The prepared cap is mounted on the substrate with lithographic precision. Thereafter, the fibers are inserted in close contact with the devices and cemented. A material having properties suitable for the cap is a photosensitive glass known as FOTURAN, a product of Schott Glaswerke. The etch rate of material that has been exposed to light (using lithographic mask techniques) is in...