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Plastic Encapsulated - Tape Automated Bonded Multi-chip Circuit Package

IP.com Disclosure Number: IPCOM000061125D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Chen, JZ: AUTHOR [+4]

Abstract

A technique is described whereby multiple circuit chips, as used in computer systems, are interconnected on polymer tape through the use of thin film circuitization implemented onto the tape. The circuit chips are bonded to polymer tape through an automated gang bonding process and then encapsulated in a plastic module. The technique is unique in that packaging costs are reduced, as compared to prior art, in that the lead frame is eliminated, no outer lead bonding is required and the size of equivalent circuit modules is reduced, allowing greater density in packaging mul tiple circuit chips.

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Plastic Encapsulated - Tape Automated Bonded Multi-chip Circuit Package

A technique is described whereby multiple circuit chips, as used in computer systems, are interconnected on polymer tape through the use of thin film circuitization implemented onto the tape. The circuit chips are bonded to polymer tape through an automated gang bonding process and then encapsulated in a plastic module. The technique is unique in that packaging costs are reduced, as compared to prior art, in that the lead frame is eliminated, no outer lead bonding is required and the size of equivalent circuit modules is reduced, allowing greater density in packaging mul tiple circuit chips.

The multi-chip package, as shown in the figure, shows circuit chips 10 with external leads 11 connected to form the input/output interconnections. The figure shows three circuit chips mounted in the module; however, the number of circuit chips is not limited to three units, but is limited only to the application requirements. The process provides chip bond 12 to se external leads 11 to circuit chips 10. Polymer circuit tape 13 is used in roll form where the polymer is excised from the tape and the leads prior to testing and encapsulation. The process is unique in that the circuits may be pretested while still on the tape reel. After pretesting, the module is encapsulated with plastic 14 to protect the circuitry.

Disclosed anonymously.

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