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Browse Prior Art Database

Flexible Shell Conduction/convection Cooling Device

IP.com Disclosure Number: IPCOM000061139D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Brzyski, R: AUTHOR [+3]

Abstract

A flexible, cylindrically-shaped device acts as a heatsink when attached to a heat generating module mounted on a printed circuit card and interfaced with an enclosure that also acts as a heatsink.

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This is the abbreviated version, containing approximately 100% of the total text.

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Flexible Shell Conduction/convection Cooling Device

A flexible, cylindrically-shaped device acts as a heatsink when attached to a heat generating module mounted on a printed circuit card and interfaced with an enclosure that also acts as a heatsink.

A metallic shell 1 (Fig. 1), having high thermal conductivity, is mounted on a module 2 by a clamp 3 or by other suit means (brazing, soldering, adhesive). The module 2 is mounted on a printed circuit card 4. A card enclosure 6 is placed over the entire PC card 4. When placed in the closed position, as seen in the end view in Fig. 2, the shell serves as a finned surface and conduction path, and the cover serves as a heatsink.

As seen in Fig. 2, the shell 1 compresses when the enclosure 6 is closed, increasing the contact area between the shell 1 and the module 2, and the shell 1 and the enclosure 6 to enhance heat transmission. The shell material is thin, so that it does not increase the air flow resistance of the assembly. Airflow, in the direction indicated by arrows (Fig. 1), removes heat from the entire configuration.

Disclosed anonymously.

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