Browse Prior Art Database

Hand Held Wire Removing Tool

IP.com Disclosure Number: IPCOM000061144D
Original Publication Date: 1986-May-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Handford, E: AUTHOR [+2]

Abstract

A hand held tool for removing thin wire from a thin-film pad without damaging the pad or the wire is disclosed. Referring to Fig. 1, wire 10 is soldered or ultrasonically bonded to thin-film metal pad 12 with bond 14. Occasionally, it is desirable to remove wire 10 without damaging either wire 10 or the pad 12.

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Hand Held Wire Removing Tool

A hand held tool for removing thin wire from a thin-film pad without damaging the pad or the wire is disclosed. Referring to Fig. 1, wire 10 is soldered or ultrasonically bonded to thin-film metal pad 12 with bond 14. Occasionally, it is desirable to remove wire 10 without damaging either wire 10 or the pad 12.

Hand held tool 16 allows the easy removal of wire 10 from pad 12 without damaging either. Ultrasonic energy provided through ultrasonic power source input 18 is transmitted through the tool 16 and eventually applied to the solder area 14. The ultrasonic energy will soften the bond 14 allowing the wire 10 to be lifted off easily. The body 20 of the tool 16 is comprised of tungsten, but can be any material capable of conducting ultrasonic energy. The tip 22, shown enlarged in Fig. 2, includ TEFLON (E.I. du Pont de Nemours & Co.) pad 24 which prevents any damage by the tool to the thin-film pad. The tip 22 has a surface lining 26 comprised of osmium. Osmium will not stick to gold on the wire surface. This allows easy removal of the wire from the pad without the problem of the wire sticking to the tool and causing damage. The ultrasonic energy is applied through the tool body and tip to the solder area 14, which causes plasticity of the bond. Hand force lifts the wire off the pad without causing damage.

Disclosed anonymously.

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