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Electroless Copper Plating Bath

IP.com Disclosure Number: IPCOM000061221D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Feher, S: AUTHOR [+2]

Abstract

By replacing the commonly used sodium cyanide (NaCN) by sodium pyrophosphate (Na4P2O7) in an electroless copper plating bath, the stability and the rate at which copper is deposited are increased. The bath preferably contains copper sulphate, a complexing agent, such as EDTA, a reducing agent, such as formaldehyde, a surfactant and Na4P2O7 .

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Electroless Copper Plating Bath

By replacing the commonly used sodium cyanide (NaCN) by sodium pyrophosphate (Na4P2O7) in an electroless copper plating bath, the stability and the rate at which copper is deposited are increased. The bath preferably contains copper sulphate, a complexing agent, such as EDTA, a reducing agent, such as formaldehyde, a surfactant and Na4P2O7 .

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