Browse Prior Art Database

Automatic Soldering Machine for Fine-Wire Connections

IP.com Disclosure Number: IPCOM000061270D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Aoki, Y: AUTHOR [+3]

Abstract

The present structure provides an automatic soldering machine designed for fine-wire connections, wherein a heater assembly is supported by a spring and a soldering tip is in contact with a wire to be joined on a slant during the soldering process. Fig. 1 shows an essential part of the automatic soldering machine. The heater assembly is supported by a spring and is moved up and down by an air cylinder when a piston of the air cylinder ascends and descends so that most weight of the heater assembly is supported by the spring. According to the present structure, controlled pressure is applied to the fine wire by the soldering tip during the soldering process to avoid cutting the wire. A thermocouple is embedded in the soldering tip in order to control the temperature of the tip precisely. Fig.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 92% of the total text.

Page 1 of 2

Automatic Soldering Machine for Fine-Wire Connections

The present structure provides an automatic soldering machine designed for fine-wire connections, wherein a heater assembly is supported by a spring and a soldering tip is in contact with a wire to be joined on a slant during the soldering process. Fig. 1 shows an essential part of the automatic soldering machine. The heater assembly is supported by a spring and is moved up and down by an air cylinder when a piston of the air cylinder ascends and descends so that most weight of the heater assembly is supported by the spring. According to the present structure, controlled pressure is applied to the fine wire by the soldering tip during the soldering process to avoid cutting the wire. A thermocouple is embedded in the soldering tip in order to control the temperature of the tip precisely. Fig. 2 shows a printed circuit to be soldered. Lands to be joined to the wires are closely positioned on the flexible printed circuit. Space between the lands is very small and may be smaller than the width of the tip. Fig. 3 shows a part of the printed circuit of Fig. 2. The soldering tip is in contact with the wire to be joined to the land on a slant during the soldering process. The slant tip prevents the tip from being in contact with neighboring wires or neighboring lands, and also prevents the wire to be joined from being dislocated from the land. The soldering process is repeated twice with respect to the wire in order t...