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Ultrasonic Or Thermosonic Wire Bond Site Stabilization Clamp

IP.com Disclosure Number: IPCOM000061384D
Original Publication Date: 1986-Jun-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Phelps, DW: AUTHOR

Abstract

An ultrasonic wire bond clamping technique is featured which stabilizes the work piece during bonding to insure consistent bonding strength and repeatable tool parameters.

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Ultrasonic Or Thermosonic Wire Bond Site Stabilization Clamp

An ultrasonic wire bond clamping technique is featured which stabilizes the work piece during bonding to insure consistent bonding strength and repeatable tool parameters.

Inserting a tape or resilient film between the lead frame and chip site to be wire bonded requires clamping to provide a stable platform for ultrasonic or thermosonic wire bonding.

The Figure shows the thermosonic bonder capillary containing a formed ball on the end of a wire. The bonder capillary positions a ball over the bond site and thermosonically fastens the ball. The bonder capillary is then automatically positioned over a lead frame finger, feeding wire through the bonder capillary orifice enroute, and fastens the other end of the wire thermosonically to complete the connection. The wire is cut, another is formed on the wire end and the capillary is ready to be positioned for the next bonding cycle.

Modular clamping fingers clamp groups of metallized leads over a resilient film or tape at the bonding site. The clamps compress the lead frame fingers, tape and chip sandwich in such a manner so as to insure a stable bonding surface and good heat transfer through the sandwich to the bonding site. This technique results in repeatable tool parameters and a consistent high strength wire bond connection.

During indexing, the clamps lift to prevent wire damage and the work holder chip slide allows free chip movement in and out of the w...