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Solder Paste Dip Join Process

IP.com Disclosure Number: IPCOM000061711D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Leslie, GG: AUTHOR [+2]

Abstract

Leads of an electronic component, such as a dual inline package and other plated through hole (PTH) components, may be joined to a printed circuit board when surface mount components, such as resistors and other active elements, are joined to the printed circuit board by vapor phase soldering. While leads for a dual inline package are normally soldered to a printed circuit board during wave soldering, the cost of wave soldering is not justified for a repair technique or a pilot run, for example. Accordingly, in these instances, the leads may be joined to the printed circuit board at the same time as the surface mount components are soldered thereto. The PTH component leads, for example, are cleaned with a mild solvent such as FREON* and dried.

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Solder Paste Dip Join Process

Leads of an electronic component, such as a dual inline package and other plated through hole (PTH) components, may be joined to a printed circuit board when surface mount components, such as resistors and other active elements, are joined to the printed circuit board by vapor phase soldering. While leads for a dual inline package are normally soldered to a printed circuit board during wave soldering, the cost of wave soldering is not justified for a repair technique or a pilot run, for example. Accordingly, in these instances, the leads may be joined to the printed circuit board at the same time as the surface mount components are soldered thereto. The PTH component leads, for example, are cleaned with a mild solvent such as FREON* and dried. The leads are then dipped at room temperature in a rosin mildly activated solder paste of 63% tin and 37% lead with a viscosity of approximately 500,000 cp. The leads have approximately 0.001" - 0.010" solder paste adhere thereto. Then, the leads are placed in the through holes in the printed circuit board, and the solder paste is dried simultaneously with the drying of the solder paste used with the surface mount components. This is the same solder paste. After the PTH components have been vapor phase soldered, they are cleaned. Results show a good solder wetting in the plated through hole. This provides a good fillet around the lead within the through hole in the printed circuit board. * Trad...