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Component Handling Tool

IP.com Disclosure Number: IPCOM000061737D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

McKnight, SR: AUTHOR [+2]

Abstract

This article describes the design features of an electronic component- handling tool which permits the removal of pluggable components from electronic assemblies. This tool is useful when the electronic assembly has a very high component density and spacing between components is minimal. The tool is comprised of a housing 1 inside of which is a snug fitting pressure shaft 2 that is threaded and is free to travel a specific distance inside the housing. The pressure shaft 2 is used to produce the gripping action necessary to hold the component 9 to be inserted or extracted from the electronic assembly board. The housing 1 and the pressure shaft 2 contain a cavity 10 that is dimensioned properly to accommodate the shape and size of the component.

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Component Handling Tool

This article describes the design features of an electronic component- handling tool which permits the removal of pluggable components from electronic assemblies. This tool is useful when the electronic assembly has a very high component density and spacing between components is minimal. The tool is comprised of a housing 1 inside of which is a snug fitting pressure shaft 2 that is threaded and is free to travel a specific distance inside the housing. The pressure shaft 2 is used to produce the gripping action necessary to hold the component 9 to be inserted or extracted from the electronic assembly board. The housing 1 and the pressure shaft 2 contain a cavity 10 that is dimensioned properly to accommodate the shape and size of the component. The cavity 10 contains an O-ring 8, made from an appropriate material, that changes shape under the pressure of the pressure shaft 2 and returns to its original shape when the pressure is withdrawn. The pressure from shaft 2 causes the O-ring to expand or bulge inside the cavity which produces a gripping action on the component. Inside the pressure shaft 2 is a loose fitting release pin 3 which is used to push the component out of the cavity when desired. The release pin is spring loaded 7 to return it to its original position when the extraction or insertion process is completed. When the pressure shaft 2 is positioned to produce the proper gripping action by the O-ring 8, a lock ring 5 is set to ma...