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Fixtureless Component Placement And Reflow for Screenless Surface Mounted Technology Process

IP.com Disclosure Number: IPCOM000061860D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Fry, BM: AUTHOR [+4]

Abstract

An arrangement is described which eliminates use of part no. dependent fixturing and expensive pick-place machine by robotic placement of modified Surface Mounted Components (SMC).

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Fixtureless Component Placement And Reflow for Screenless Surface Mounted Technology Process

An arrangement is described which eliminates use of part no. dependent fixturing and expensive pick-place machine by robotic placement of modified Surface Mounted Components (SMC).

Present SMC components are modified by providing two orientation and registration pins. The pins are part of plastic molded body of the component. Placement tool/equipment picks up parts and inserts them on surface pattern of Printed Circuit Board (PCB) where two holes are provided to accept pins, thus providing positive registration.

The assembled card is then reflowed in vapor phase equipment to complete the solder joints. The tolerance of the pins is such that a floating action is maintained for the component to adjust during reflow.

This new arrangement relates to screenless surface mount process to eliminate use of screen and paste screening equipment by providing required solder on the pads using immersion wave soldering technique.

The advantages of the arrangement include the elimination of fixturing that changes with each part number, simpler and inexpensive placement tools, and that no adhesive is required for holding components.

Disclosed anonymously.

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