Browse Prior Art Database

Mount for Laser And Lens

IP.com Disclosure Number: IPCOM000061900D
Original Publication Date: 1986-Jul-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Baasch, HJ: AUTHOR [+2]

Abstract

A spring loaded mount is bonded between a holder for a semiconductor laser and a holder for a lens system. The moun prebonded to the lens holder and is spot bonded to multiple points on the laser holder after the laser is correctly positioned in the mount. Spot bonding minimizes any movement of laser relative to the lens as the bonding adhesive cures.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Mount for Laser And Lens

A spring loaded mount is bonded between a holder for a semiconductor laser and a holder for a lens system. The moun prebonded to the lens holder and is spot bonded to multiple points on the laser holder after the laser is correctly positioned in the mount. Spot bonding minimizes any movement of laser relative to the lens as the bonding adhesive cures.

In Fig. 1, mount 10 consists of a flat ring 12 and six spokes 14. The mount is made of a resilient material so the spokes 14 will operate to grip an element centered amongst the spokes.

In Fig. 2, lens holder 16 is bonded to flat ring 12 of mount 10. After the bonding has cured, laser holder 18 is placed inside spokes 14. The spokes hold the laser in place. When the laser is correctly positioned relative to the lens, adhesive is applied at spots 20 where each spoke contacts laser holder 18.

Disclosed anonymously.

1