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Surface And Hole Cleaning Technique for Raw Boards

IP.com Disclosure Number: IPCOM000061929D
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kolesinskas, FP: AUTHOR

Abstract

The cleaning of a printed circuit board (PCB) commonly employs a method of spraying with a chemical bath and/or brushing. This method has the limitating factors of risk to circuit lines and that the spraying of chemicals may redeposit contaminants elsewhere on the board, or move contaminants to connector ho which can cause product failure or serve as long term reliability risk sites. A method of cleaning a PCB without these limits is described in the following.

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Surface And Hole Cleaning Technique for Raw Boards

The cleaning of a printed circuit board (PCB) commonly employs a method of spraying with a chemical bath and/or brushing. This method has the limitating factors of risk to circuit lines and that the spraying of chemicals may redeposit contaminants elsewhere on the board, or move contaminants to connector ho which can cause product failure or serve as long term reliability risk sites. A method of cleaning a PCB without these limits is described in the following.

A high-pressure Freon TF spray system removes particulate matter and oily contaminants from both the surface and connecting holes. The spray is directed at the PCB at 45OE, or less to remove particulate matter. The spray is also directed at the board surface at 90OE to clean the connecting holes. The rate of application is four gallons per minute or more for a duration of at least twenty seconds.

Disclosed anonymously.

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