Browse Prior Art Database

Plasma Compatible Composite External Process

IP.com Disclosure Number: IPCOM000061932D
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Lemon, G: AUTHOR [+5]

Abstract

The construction of a composite circuit board commonly utilizes a peel-apart copper surface for the development of external circuitry. apart surface is sensitive and poses sev This peel-apart surface is sensitive and poses several manufacturing difficulties. A method of making composites, without peel-apart copper, that is plasma compatible, is accomplished lowing. in the following.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Plasma Compatible Composite External Process

The construction of a composite circuit board commonly utilizes a peel-apart copper surface for the development of external circuitry. apart surface is sensitive and poses sev This peel-apart surface is sensitive and poses several manufacturing difficulties. A method of making composites, without peel-apart copper, that is plasma compatible, is accomplished lowing. in the following.

The composite is laminated with a sacrificial copper to provide the correct surface morphology required for proper copper/laminate bond strength. The copper is etched off and replaced with an aluminum mask to protect the surface during processing.

The aluminum clad composite is drilled and plasma hole cleaned. The aluminum mask is removed and the composite is processed through a methylene chloride stripper to remove any residual adhesive. The composite is then seeded, photo processed and additive plated. After plating the resist is stripped off and the circuitization is complete.

Disclosed anonymously.

1