Browse Prior Art Database

Method of Preparing Ground Or Lapped Ceramic Substrates

IP.com Disclosure Number: IPCOM000061938D
Original Publication Date: 1986-Aug-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hayunga, CP: AUTHOR [+2]

Abstract

This proposal suggests the use of ultrasonics following grinding or lapping of ceramic substrates. The method removes the surface layer which has been damaged by the grinding operation.

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Method of Preparing Ground Or Lapped Ceramic Substrates

This proposal suggests the use of ultrasonics following grinding or lapping of ceramic substrates. The method removes the surface layer which has been damaged by the grinding operation.

In the manufacture of ceramic substrates they are frequently ground using an abrasive wheel or lapped with a slurry to render them flat and smooth. This preparation method can have adverse effects on the ceramic. There may be microcracks and stresses in the surface due to the abrasive action to interface failure in the substrate.

In the grinding or lapping of ceramics, material removal occurs by inducing cracking and the concurrent removal by fracture of successive thin surface layers by contact with the abrasive particles. Usually at the cessation of grinding, areas remain on the surface which have cracked but are still integral with the surface. Removal of this damaged layer is that which the proposal addresses.

When the ceramic surface, following grinding or lapping, is exposed to the moderately intense cavitation field of an ultrasonic horn, it will produce propagation of cracks which have reached the surface. This then facilitates removal of the weak surface region.

Disclosed anonymously.

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