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Complete Lead Frame Singulation And Deflashing Method

IP.com Disclosure Number: IPCOM000061980D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Bosley, R: AUTHOR [+4]

Abstract

A mechanism and method is described which cuts plastic encapsulated semiconductor modules (plastic modules) away from a frame (singulates the modules), removes plastic flash from the lead frame tie bar, and delivers oriented modules to process carriers.

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Complete Lead Frame Singulation And Deflashing Method

A mechanism and method is described which cuts plastic encapsulated semiconductor modules (plastic modules) away from a frame (singulates the modules), removes plastic flash from the lead frame tie bar, and delivers oriented modules to process carriers.

The figure is a cross section showing a plastic module 2, with its lead frame 4 clamped by lead frame clamp 6. When plunger 8 is moved downward, tie bars 10 are sheared and any plastic flash in the vicinity of the tie bars is removed. The plastic module 2 is pushed through the control gate 12, whereupon the singulated module drops into a process carrier (not shown) for subsequent processing, e.g. baking and tinning.

When the plunger 8 is fully withdrawn upward, the lead frame clamp 6 moves upward releasing pressure on selvage of the lead frame 4. Thus, when another plastic module attached to its lead frame is slid into position, the selvage is pushed out by the new lead frame. Note that the control gate 12 is sized appropriately relative to the edges of the plastic module 2 to provide automatic side-to-side alignment of the plastic module in the mechan

A multiplicity of such mechanisms may be assembled to permit singulation of multiple plastic modules simultaneously.

Disclosed anonymously.

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