Browse Prior Art Database

Thermal Cap With Direct Heat Sink

IP.com Disclosure Number: IPCOM000061990D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Engle, SR: AUTHOR [+4]

Abstract

As module devices become larger, denser, and more integrated the problem of removing undesired heat becomes more critical. A method of directly attaching a high efficiency heat sink to a module cap provides improved heat dissipation from large devices.

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Thermal Cap With Direct Heat Sink

As module devices become larger, denser, and more integrated the problem of removing undesired heat becomes more critical. A method of directly attaching a high efficiency heat sink to a module cap provides improved heat dissipation from large devices.

A graphite mold 1 (Fig. 1), for the desired heat sink configuration is constructed and filled with pure copper powder 2. A copper module cap 3 is then positioned on top of graphite mold 1 and held by a clamp 4.

The clamped assembly is then processed through a conveyorized sintering furnace at an operating temperature of approximately 1900OEF. The sintering time is one hour in an atmosp of dissociated ammonia.

The sintered copper powder 2 will adhere to the copper module cap 3, as seen in Fig. 2, to produce an integrated cap with a finned heat sink 5.

After sintering, the clamp 4 is removed and the sintered copper powder 2, now attached to the module cap 3, is removed from mold 1 and placed in the orientation it will be used in (Fig. 2). The integrated cap 2, 3 has fins 5 for heat removal.

Disclosed anonymously.

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