Browse Prior Art Database

Chemically Compatible Composite External Process

IP.com Disclosure Number: IPCOM000061993D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

McCarthy, WJ: AUTHOR [+3]

Abstract

A method of manufacturing a printed circuit board composite that eliminates the use of peel-apart copper and its associated problems is as follows.

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Chemically Compatible Composite External Process

A method of manufacturing a printed circuit board composite that eliminates the use of peel-apart copper and its associated problems is as follows.

The composite is laminated with a sacrificial copper surface that provides the correct surface morphology for the proper copper/laminate bond strength. The copper surface is etched off and a polyethylene terephthalate film is applied with a resist laminator to the board surface to protect it during processing.

The tape-clad circuit board composite is then drilled using a clearance template and a stackable vacuum chuck.

After drilling, the composite is processed through vapor blast, chemical hole clean, and vapor blast again. The circuit board tape is then peeled off and the board is processed through a methylene chloride stripper to remove residual adhesive. The board is then seeded, photo processed, and additive plated. After additive plating the resist is stripped off and the board's circuitization is complete.

Disclosed anonymously.

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