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Browse Prior Art Database

Elimination of Hcl Rinse And Substitution of Water Rinse

IP.com Disclosure Number: IPCOM000061995D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 7K

Publishing Venue

IBM

Related People

Burnett, PA: AUTHOR [+4]

Abstract

In the fabrication of printed circuitry utilizing peel apart copper, the copper surface is rinsed with HCl prior to additive plating. The HCl removes any oxide that is on the peel apart copper surface, and it also acts as an accelerator.

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Elimination of Hcl Rinse And Substitution of Water Rinse

In the fabrication of printed circuitry utilizing peel apart copper, the copper surface is rinsed with HCl prior to additive plating. The HCl removes any oxide that is on the peel apart copper surface, and it also acts as an accelerator.

In a process where copper is plated directly onto an epoxy surface without the use of peel apart copper, the use of an HCl rinse can be eliminated and a water rinse can be substituted in its place. This has cost, ecological and other advantages.

It is noted that an HCl rinse will effectively accelerate or strip Sn and Pd from the catalyzed surface. In the case where the seeding was weak or marginal, this can result in voids during plating, with the result that the part must be scrapped.

Disclosed anonymously.

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