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Flowless Fluid Cooling Scheme for Air Cooled Modules

IP.com Disclosure Number: IPCOM000061997D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Pennell, GF: AUTHOR [+3]

Abstract

A bellows, filled with a thermally conductive fluid, is utilized to remove heat from a chip mounted on a module. The bellows protrude through the cap and remove the heat to the ambient.

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Flowless Fluid Cooling Scheme for Air Cooled Modules

A bellows, filled with a thermally conductive fluid, is utilized to remove heat from a chip mounted on a module. The bellows protrude through the cap and remove the heat to the ambient.

A bellows 1, typically made of copper, or an alloy, removes heat from a chip 2, mounted on a module 3 by interfacing it with a thermal grease 4 that provides electrical isolation but conducts heat. The heat is conducted through the bellows 1 w contains a highly thermal conductive fluid 5 to the ambient. The bellows 1 are filled with fluid 5 to a level commensurate with the thermal expansion coefficient to prevent bellows 1 from becoming over-pressurized. The bellows 1 are sealed.

The bellows 1 are flexible and provide alignment to chip 2 that may be misaligned.

By extending through cap 6, to a height of choice, an increased area for heat transfer is provided to suit thermal transfer needs.

The above described bellows can be utilized on multiple modules by having the fluid completely surround the individual chips and common to a sealed bellows. The bellows would be sealed at the cap.

Disclosed anonymously.

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