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Quick-connect Low Profile Heat Sink

IP.com Disclosure Number: IPCOM000061999D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kasdagly, DG: AUTHOR [+3]

Abstract

A module heatsink that is designed for use in a constricted environment must have a low profile. The heatsink can be thermally enhanced by an overhang that extends the heatsink beyond the module, but this configuration is often difficult to manufacture. The same effect is realized in a multipiece construction that can give similar thermal performance of a single when mounted to either end of a primary heatsink, as described in the following.

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Quick-connect Low Profile Heat Sink

A module heatsink that is designed for use in a constricted environment must have a low profile. The heatsink can be thermally enhanced by an overhang that extends the heatsink beyond the module, but this configuration is often difficult to manufacture. The same effect is realized in a multipiece construction that can give similar thermal performance of a single when mounted to either end of a primary heatsink, as described in the following.

A module 1, pinned to card 2, dissipates heat to a primary heatsink 3. The attachment of quick-connect heatsinks 4, by means of press-fitted spring clips 5, serves as a thermal enhancement by removing heat from the primary heatsink 3.

The use of a thermal compound 6 or conductive gasket minimizes contact resistance to remove heat.

Disclosed anonymously.

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