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Modified Solder Level Processing for Soldering Mixed Technology Circuit Boards

IP.com Disclosure Number: IPCOM000062010D
Original Publication Date: 1986-Sep-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Dalbo, JM: AUTHOR [+3]

Abstract

Described is a process for soldering mixed components (surface mounted components and pin through components) to a circuit board. A modified soldering level process is used to build up a thick layer on pads to be used to support surface mounted components. The circuit board is then fluxed and heated through melt point of solder to eliminate any solder bridges that may result from the modified solder level process. A relatively thin layer of solder is also provided on the remainder of the circuit board to permit soldering for the pin through components.

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Modified Solder Level Processing for Soldering Mixed Technology Circuit Boards

Described is a process for soldering mixed components (surface mounted components and pin through components) to a circuit board. A modified soldering level process is used to build up a thick layer on pads to be used to support surface mounted components. The circuit board is then fluxed and heated through melt point of solder to eliminate any solder bridges that may result from the modified solder level process. A relatively thin layer of solder is also provided on the remainder of the circuit board to permit soldering for the pin through components.

The soldering layers may be laid down in accordance with the following processing steps:

Step 1: A solder level having a thickness between 0.001" - 0.005" is formed on the appropriate zones of the circuit board, by adjusting the setup controls of a standard soldering level machine. The exact machine setup will vary with the type of solder leveling machine. After the soldering level step, the circuit board is fluxed and heated through the melt point of solder to eliminate any solder bridges that may result from the modified solder level process. This may be done in a standard infrared belt reflow oven.

Step 2: The surface mounted pads are covered with a brush on coating or tape. The brushed-on coating or tape should be a conventional water or solvent strippable "solder stop-off." Next cure the stop-off coating.

Step 3: Apply a thin (conve...