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Centrifuge With Automatic Load-Unload

IP.com Disclosure Number: IPCOM000062045D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Dezauzier, P: AUTHOR [+2]

Abstract

In the semiconductor industry the wet process operation requires a centrifuge load-unload operation, either at the wet bench drying level or for the so-called spray processor equipment. Several solutions are currently proposed to automate the operation, most of them using a sophisticated, expensive robot. Here, we describe a hard automation solution which allows the user to maintain the high capacity of classical wet benches while providing low-cost automatic product handling. Basically, the tool is a high capacity (several wafer carriers) centrifuge, with almost a horizontal axis, provided with a handling mechanism having two sub-systems. The first sub-system is a conveyor bringing the wafer-carriers into the location to be loaded-unloaded inside the centrifuge by the second sub-system, which is a push-pull mechanical fixture.

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Centrifuge With Automatic Load-Unload

In the semiconductor industry the wet process operation requires a centrifuge load-unload operation, either at the wet bench drying level or for the so-called spray processor equipment. Several solutions are currently proposed to automate the operation, most of them using a sophisticated, expensive robot. Here, we describe a hard automation solution which allows the user to maintain the high capacity of classical wet benches while providing low-cost automatic product handling. Basically, the tool is a high capacity (several wafer carriers) centrifuge, with almost a horizontal axis, provided with a handling mechanism having two sub-systems. The first sub-system is a conveyor bringing the wafer- carriers into the location to be loaded-unloaded inside the centrifuge by the second sub-system, which is a push-pull mechanical fixture. Carriers and wafers are held inside the chamber, allowing turn-table indexing. A sealed door closes the chamber, allowing the process to be started. The tool may provide chemical products, including D.I. water and nitrogen, to the wafers and can be easily turned into a combination of spray and/or dip chemical processor at low spin speed. Special attention has been put on particulate generation and building materials are adapted to the semiconductor wet process state of the art from a chemical point of view. A microprocessor-based tool controller drives the tool and peripheral equipment.

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