Browse Prior Art Database

Multi-Chip Plastic Leaded Chip Carrier

IP.com Disclosure Number: IPCOM000062052D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Overfield, RB: AUTHOR [+2]

Abstract

A packaging arrangement which provides a cost-effective, surface mountable, high I/O, single/multi-chip package is described. The lead frame of this packaging concept is fabricated from a two-layer laminate system, as shown in the figure. PROCESS DESCRIPTION 1. Lead Frame - The material used to make the lead frame is a two- layer laminate with 0.0007 inch EDP copper foil laminated to 0.008 inch CDA 155 copper. The adhesive used is 0.002 inch dry film high-temperature polyamide film. The chip fan-out is printed and etched on 0.0007-inch-thick copper. The back side has a simple window frame with connections for grounds only. 2.

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Multi-Chip Plastic Leaded Chip Carrier

A packaging arrangement which provides a cost-effective, surface mountable, high I/O, single/multi-chip package is described. The lead frame of this packaging concept is fabricated from a two-layer laminate system, as shown in the figure. PROCESS DESCRIPTION 1. Lead Frame - The material used to make the lead frame is a two- layer laminate with 0.0007 inch EDP copper foil laminated to
0.008 inch CDA 155 copper. The adhesive used is 0.002 inch dry film high- temperature polyamide film. The chip fan-out is printed and etched on 0.0007- inch-thick copper. The back side has a simple window frame with connections for grounds only. 2. Chip-Joining - For C-4 mounted devices, a high temperature photosensitive dielectric 16, such as Du Pont's photo-formed plastic material is applied to lead frame 10 prior to chip-joining to act as a solder dam. Alternately, chips may be wire-bonded. 3. Encapsulation - The lead frame 10 with the chip 12 is then encapsulated using the standard process for plastic leaded chip carriers. Leads 18 are then cropped and bent to finish the package.

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