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Stroke Minimization of a Programmable Punch Tool

IP.com Disclosure Number: IPCOM000062054D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 3 page(s) / 48K

Publishing Venue

IBM

Related People

Sherwood, MD: AUTHOR [+2]

Abstract

The punch strokes required of a programmable punch die set when punching a via hole pattern in a multilayer ceramic green sheet may be appreciably reduced by use of the punch algorithm described below. The more general problem solved is that of using a rectangular array of programmable instruments to punch, drill or flash spots onto a surface, with a minimum number of moves. The time required to calculate punch strokes by use of this algorithm is absorbed in the punch data post- processing step and does not impact actual punch operations. Substantial increases in the throughput of punch tools have been realized. The punch stroke algorithm is implemented in a single software package which supports various punch die sets and product types. Under this procedure an entire via pattern is examined at one time.

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Stroke Minimization of a Programmable Punch Tool

The punch strokes required of a programmable punch die set when punching a via hole pattern in a multilayer ceramic green sheet may be appreciably reduced by use of the punch algorithm described below. The more general problem solved is that of using a rectangular array of programmable instruments to punch, drill or flash spots onto a surface, with a minimum number of moves. The time required to calculate punch strokes by use of this algorithm is absorbed in the punch data post- processing step and does not impact actual punch operations. Substantial increases in the throughput of punch tools have been realized. The punch stroke algorithm is implemented in a single software package which supports various punch die sets and product types. Under this procedure an entire via pattern is examined at one time. Analysis then proceeds through every group of vias, which are separated horizontally by a multiple of the x pin pitch and vertically by a multiple of the y pin pitch. A flow chart of the algorithm is shown in Figs. 1 and 2, with the definitions and notations below. Steps in the procedure are numbered to correspond with Figs. 1 and 2. Definitions and Notations x pin pitch the distance between any two horizontally adjacent pins y pin pitch the distance between any two vertically adjacent pins cols the number of columns of pins in the punch die set rows the number of rows of pins in the punch die set (xl, xh) the horizontal range of the via pattern (yl, yh) the vertical range of the via pattern SM rows the number of rows in the matrix SM SM cols the number of columns in the matrix SM Step 1:For each via determine Ix = (via's x coordinate - xl) /x pin pitch Rx = remainder of [(via's x coordinate - xl)/x pin pitch] Iy = (yh - via's y coordinate)/y pin pitch Ry = remainder of [yh - via's y coordinate)/y pin pitch] Ix, Rx, Iy, Ry are functions of the vertical and horizontal distances, from the via to the upper left corner of the via range. Note: Vias which do not have the same (Rx, Ry) pair cannot be punched with one stroke of the punch die set. Step 2: Build an array M of dimensions, maximum (Iy) by maximum (Ix). Note: If the punch die set were of these dimensions, then each group of vias with the same (Rx, Ry) pair could be punched with one stroke. Step 3: Sort the Ix, Rx, Iy, Ry records (one per via) by Rx then by Ry, to group the vias by their (Rx, Ry) pa...