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Active Test Placement Probe

IP.com Disclosure Number: IPCOM000062100D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Chirico, C: AUTHOR [+4]

Abstract

This article describes an arrangement which allows testing of a capacitor component prior to module assembly, thereby eliminating any defects which can be attributed to the capacitor's electrical properties. Capacitor components used in hybrid modules are usually tested for opens, shorts or specific capacitance value after module assembly. A defective capacitor can damage other components on the module leading to costly rework or scrap of that module. The active test placement probe (ATP) disclosed herein will allow testing of a capacitor component prior to module assembly, thereby eliminating any defects which can be attributed to the capacitor's electrical properties. Fig. 1 illustrates a typical pick and place concept which shows the ATP, capacitor component carrier, and the module substrate.

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Active Test Placement Probe

This article describes an arrangement which allows testing of a capacitor component prior to module assembly, thereby eliminating any defects which can be attributed to the capacitor's electrical properties. Capacitor components used in hybrid modules are usually tested for opens, shorts or specific capacitance value after module assembly. A defective capacitor can damage other components on the module leading to costly rework or scrap of that module. The active test placement probe (ATP) disclosed herein will allow testing of a capacitor component prior to module assembly, thereby eliminating any defects which can be attributed to the capacitor's electrical properties. Fig. 1 illustrates a typical pick and place concept which shows the ATP, capacitor component carrier, and the module substrate. The ATP proceeds to pick up a capacitor from its carrier by using vacuum. When the ATP makes contact with the capacitor, an electrical test is performed. At the conclusion of the test, if the capacitor is determined to be good, the ATP proceeds to place the capacitor onto the module substrate. Should the conclusion of the test determine that the capacitor is defective, the ATP either leaves the capacitor in the carrier or proceeds to dispense it somewhere else. In the case where a capacitor is missing from the carrier when the ATP attempts to test it, vacuum sensing can provide sufficient intelligence to determine that the capacitor is actually...