Browse Prior Art Database

Repair of Metal Fracture

IP.com Disclosure Number: IPCOM000062152D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Chin, D: AUTHOR [+2]

Abstract

This article relates generally to integrated circuit construction and, more particularly, to repair of metal layers in contact openings. Metal layers can become broken at the sharp corners of deep contact holes, but selective metal deposition enables repair of the fracture. Since a metal can be selectively deposited on a similar metallic layer, broken points can be repaired. For example, in the figure an extra tungsten layer 1 can grow conformally on a tungsten or aluminum layer 2 at low temperature. Since the break at the corners 3 is narrow, a small amount of added metal can repair the break.

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Repair of Metal Fracture

This article relates generally to integrated circuit construction and, more particularly, to repair of metal layers in contact openings. Metal layers can become broken at the sharp corners of deep contact holes, but selective metal deposition enables repair of the fracture. Since a metal can be selectively deposited on a similar metallic layer, broken points can be repaired. For example, in the figure an extra tungsten layer 1 can grow conformally on a tungsten or aluminum layer 2 at low temperature. Since the break at the corners 3 is narrow, a small amount of added metal can repair the break.

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