Browse Prior Art Database

Stick-on Heat Sink

IP.com Disclosure Number: IPCOM000062231D
Original Publication Date: 1986-Oct-01
Included in the Prior Art Database: 2005-Mar-09
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Kotrch, GS: AUTHOR [+3]

Abstract

A heatsink design which has the flexibility to be added to a module at any time, i.e., after production or assembly, works in the following manner.

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This is the abbreviated version, containing approximately 100% of the total text.

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Stick-on Heat Sink

A heatsink design which has the flexibility to be added to a module at any time, i.e., after production or assembly, works in the following manner.

Heatsink 1 is attached to a module 2 by placing heatsink 1 over module 2 and pushing downward until sides 3 flex outward and pass over the edges of module 2 until lip 4 is past bottom of module 2 and sides 3 snap closed to secure heatsink 1 to module 2.

The placement of an adhesive or double sided tape to the bottom surface 5 (shaded area) of heatsink 1 assures intimate contact to module 2.

Disclosed anonymously.

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